Optoelectronic module and a process for the production of an optoelectronic module

ABSTRACT

An optoelectronic module ( 100 ) is defined, comprising at least one semiconductor chip ( 10 ) provided for emitting electromagnetic radiation and at least one holding device ( 20 ) which is adapted to fix in place a device ( 50 ) for encoding at least one optical or electronic parameter of the optoelectronic module ( 100 ). Furthermore, a process for the production of the optoelectronic module ( 100 ) is defined.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a divisional application of U.S. patentapplication Ser. No. 14/383,091 entitled “OPTOELECTRONIC MODULE AND APROCESS FOR THE PRODUCTION OF AN OPTOELECTRONIC MODULE,” filed on Sep.4, 2014, which is the national stage of entry of International PatentApplication No. PCT/EP2013/054286, filed on Mar. 4, 2013, which claimsthe benefit of priority under 35 U.S.C. §119 of German PatentApplication 10 2012 101 818.9 filed on Mar. 5, 2012, all of which arehereby incorporated by reference in their entirety for all purposes.

DESCRIPTION

An optoelectronic module and an illumination device comprising anoptoelectronic module according to the invention are defined.Furthermore, a process for the production of an optoelectronic module isdefined.

In radiation-emitting optoelectronic semiconductor devices of one typeand manufacturer the production process can give rise to differences inrespect of the brightness or the colour location of the emitted lightwhich make it necessary to carry out categorisation (“binning”) of thesemiconductor devices. In many applications it is necessary that acontrol unit used for driving the optoelectronic semiconductor device isable to acquire information relating to the categorisation.

An example that may be mentioned is a light-emitting diode moduleinstalled in a motor vehicle headlamp. After an accident it may benecessary to replace a headlamp insofar as a control unit associatedwith the headlamp is still operational. Since it is important that thereplacement headlamp does not differ too substantially in terms ofbrightness from that originally used, the light control unit must berendered capable of acquiring information relating to the brightness ofthe newly installed light-emitting diode module.

A number of solutions to this problem are known from the prior art. Onesolution comprises soldering onto the circuit board carrying thelight-emitting diode chip one or more resistors (what are known asbinning resistors) the value of which represents the brightness of thelight-emitting diode module. If an existing light-emitting diode moduleis then replaced by a new one, the light control unit is able todetermine the resistance and operate the light-emitting diode module,for example by means of pulse width modulation, in such a way that thebrightness of the light generated corresponds to the brightness of thelight-emitting diode module originally used. A disadvantage of thissolution is that certain parts of the light-emitting diode module canbecome damaged by an additional soldering process.

Another solution comprises retroactively modifying the size of aresistor already provided on the circuit board, for example by lasertrimming. A disadvantage of this solution is that additional apparatusneeds to be available in order that the resistance value can be exactlyadjusted. Should the resistors already present be destroyed by anelectrical pulse, however, it is necessary to provide correspondingadditional contacts. Overall this represents a substantial outlay interms of apparatus.

One problem of the invention is that of defining an optoelectronicmodule to which information relating to the optical parameters thereofcan be applied economically and by simple technical means.

That problem is solved by an optoelectronic module in accordance withpatent claim 1.

A further problem to be solved is that of producing an optoelectronicmodule.

That problem is solved by a process in accordance with patent claim 13.

Advantageous configurations and developments of the optoelectronicmodule and of the process are defined in the respective dependentclaims.

In accordance with a preferred embodiment, the optoelectronic modulecomprises at least one semiconductor device provided for emittingelectromagnetic radiation and at least one holding device which isadapted to fix in place a device (component) for encoding at least oneoptical or electronic parameter of the optoelectronic module.

The semiconductor device is, for example, a laser diode, a laser diodechip, a light-emitting diode or a light-emitting diode chip.

The holding device is preferably adapted to effect irreversible fixingof the device. That is to say, the device is adapted to be inserted intothe holding device by the application of little or no force, but can beremoved therefrom only by the application of a substantial amount offorce or by destruction of the holding device.

Furthermore, it is preferred that the holding device be adapted to fixin place a device (component) that is in the form of a parallelepipedhaving a first side length of between 0.4 and 7.3 mm, especially between1.5 and 2.5 mm, a second side length of between 0.2 and 6.1 mm,especially between 0.5 and 1.5 mm, and a third side length of between0.1 and 4 mm, especially between 0.5 and 1.5 mm, that is to say in arange between lengths that respectively correspond to the smallest andlargest possible forms of an SMD device (SMD=“surface-mountabledevice”).

It is also preferred that the holding device be in the form of aprotective device that at least partly encompasses a device fixed in theholding device.

The holding device makes it possible for a device for encoding theproperties of the optoelectronic module to be inserted therein withoutthe need for an additional soldering operation or any other kind ofmanipulation of the optoelectronic module requiring the use ofadditional apparatus. In accordance with at least one embodiment, theoptoelectronic module further comprises a carrier element. The holdingdevice is arranged on or in the carrier element or on or in a plug-inelement or plug-in connector attached to the carrier element.

In particular, the holding device is formed at least in part by a recessin the carrier element, plug-in element or plug-in connector.

The optoelectronic module can further comprise at least two electricalconductor tracks which are adapted to be brought into conductiveconnection with terminals of a control unit and which are in conductiveconnection with at least two electrical contact elements arranged in theholding device. By means of the two electrical conductor tracks it ispossible to make an electrical connection to a control unit via whichinformation relating to an optical or electronic parameter of theoptoelectronic module can be acquired by the control unit. In accordancewith a preferred embodiment of the optoelectronic module, the holdingdevice comprises at least one locking device which is movable between alocking position and a receiving position. In the receiving position, adevice (component) can be displaced along an insertion direction towardsa fixing position inside the holding device. In the locking position,however, the locking device is adapted to effect at least partial fixingof the device in the fixing position. That is to say, in the lockingposition the locking device can be adapted to fix the device in thefixing position at least in respect of one direction, while other partsof the holding device effect fixing in respect of other directions. Itis, however, equally possible for the locking device to effect totalfixing of the device in the fixing position.

In a preferred development, the locking device comprises at least onelocking element made of elastic material. The locking element is adaptedto allow displacement of a device along the insertion direction towardsthe fixing position. This takes place as a result of the lockingelement's being elastically deformed in consequence of the displacement.Furthermore, the locking element is arranged so that, once the fixingposition of the device has been reached, it assumes its original shapeor a shape relatively similar to its original shape and in that wayfixes the device in place.

As a result of such an arrangement, a self-closing mechanism isprovided. As a consequence of the displacement of the device, whichtakes place along the insertion direction and ends in the fixingposition, the locking element made of elastic material yields andchanges from its original shape, which corresponds to the lockingposition of the locking device, to a shape that corresponds to thereceiving position of the locking device. Once the fixing position ofthe device has been reached, the locking element, under the action of anelastic restoring force, returns to the locking position in which itassumes its original shape or a shape relatively similar to its originalshape.

The locking element can preferably be in the form of a tongue which, inthe locking position, forms an acute angle of less than 30° with theinsertion direction and projects from a lateral inner wall of theholding device.

In accordance with a further preferred embodiment, the optoelectronicmodule further comprises at least one encoding element which carriesinformation relating to an optical or electronic parameter of theoptoelectronic module and is fixed in place by the holding device.

The optical or electronic parameter of the optoelectronic module is, forexample, a brightness or a colour location of the electromagneticradiation emitted by the semiconductor device. Such parameters arepreferably nominal or initial parameters the values of which aretypically determined prior to the actual start-up of the optoelectronicmodule at its intended location using a measuring apparatus locatedexternally of the optoelectronic module. For that purpose, prior to theactual start-up of the optoelectronic module the semiconductor devicearranged thereon is operated at a reference current and at a referencetemperature. The values for the brightness and the colour locationdetermined by the measuring apparatus then form the basis for theinformation carried in analog or digital form by the encoding element.

Information relating to the colour location are of interest when theradiation emitted by the optoelectronic module is not limited to asingle wavelength. Rather, by means of a conversion element arrangeddownstream of the at least one semiconductor device in the direction ofemission, the wavelength of the radiation generated thereby can undergoat least partial conversion. Typically the conversion element absorbs atleast a portion of the radiation emitted by the semiconductor device andthen emits preferably radiation of a greater wavelength than thewavelength of the radiation originally emitted by the semiconductordevice. As a result, mixed-colour light, preferably white light, can begenerated.

It is further possible to generate mixed-colour light by using at leasttwo semiconductor devices that emit light of different wavelengths andby mixing the light thereof as desired.

The colour location of the mixed-colour light so generated can bedetermined with reference to any desired colour space, it being possibleto use, for example, a standard colour space system such as a CIE colourspace system or a DIN colour space system.

In a preferred development of the invention, the holding device furthercomprises a cover element.

The information relating to the optical or electronic parameter of theoptoelectronic module can be stored in the encoding element in variousways. Preferably, a control unit for driving the optoelectronic moduleis able to acquire the information provided by the encoding element viatransmission means.

For that purpose the encoding element can comprise a resistor theresistance value of which corresponds to the optical or electronicparameter of the optoelectronic module or is dependent thereon. In thatcase a control unit used for driving the optoelectronic module isadapted to determine the resistance of the encoding element, for exampleby measuring a voltage drop across the resistor.

Furthermore, the encoding element can comprise a capacitor thecapacitance of which corresponds to the optical or electronic parameterof the optoelectronic module or is dependent thereon. Preferably in thatcase a control unit used for driving the optoelectronic module candetermine a capacitance of the capacitor, for example by checking theresonance behaviour of the encoding element.

Furthermore, the encoding element can comprise a memory unit in whichthere are stored digital values which correspond to the optical orelectronic parameter of the optoelectronic module or are dependentthereon. Preferably a control unit used for driving the optoelectronicmodule is adapted to read out the digital values stored in the memoryunit.

In a further preferred embodiment of the invention, the encoding elementis a surface-mountable device which can also be referred to as an SMDdevice (SMD =“surface-mountable device”). In this connection referenceis also made to surface-mounting technology (SMT, “surface-mountingtechnology”).

Preferably, however, the encoding element in the form of asurface-mountable device is not soldered to the optoelectronic module,as is usually provided in the context of surface-mounting technology.Rather, the use of surface-mountable devices is advantageous because, byvirtue of their small dimensions, they require little space andcomponent placement can be effected in series and thereforeeconomically. Furthermore, SMD resistors and SMD capacitors areavailable in a large number of standard sizes and resistance values andcapacitances. Finally, the use of surface-mountable devices allows theinsertion thereof into the holding device provided for that purpose in apick-and-place machine. For example, it is possible to use resistorshaving nominal values that correspond to an e-series.

In accordance with a further preferred embodiment of the invention, theencoding element has at least two electrical contact surfaces which arein electrical contact with the electrical contact elements of theholding device.

There is further defined an illumination device which comprises acontrol unit for driving the optoelectronic module, and transmissionmeans. Via the transmission means the information provided by theencoding element can be acquired by the control unit. Typically thetransmission means comprise the above-described electrical conductortracks of the optoelectronic module.

There is further defined a process for the production of anoptoelectronic module as described in connection with at least one ofthe above embodiments.

In accordance with at least one embodiment of the production process,first of all an optoelectronic module having at least one semiconductordevice provided for emitting electromagnetic radiation is provided.Subsequently an optical or electronic parameter of the optoelectronicmodule is measured. For example, a brightness of the optoelectronicmodule can be measured by operating the semiconductor device at areference current and at a reference temperature.

In a further process step, an encoding element is provided which carriesinformation relating to the measured optical or electronic parameter ofthe optoelectronic module.

In a final process step, the encoding element is fixed in place in or onthe optoelectronic module.

In particular, the encoding element can be fixed in a holding deviceprovided for that purpose. This makes it possible to mount the encodingelement in or on the optoelectronic module without an additionalsoldering operation being required for that purpose.

In a preferred embodiment, in the first process step an optoelectronicmodule is provided which comprises at least one holding device having alocking device which is movable between a locking position and areceiving position. In the receiving position, a device can be displacedalong an insertion direction towards a fixing position inside theholding device. In the locking position, however, the locking device isadapted to effect at least partial fixing of the device in the fixingposition. In the final process step, the encoding element can then beinserted or pushed into the fixing position along the insertiondirection.

In a further embodiment of the invention, at least one of theabove-described process steps is carried out at least partly in apick-and-place machine. In particular, an encoding element having theappropriate properties can be lifted by means of vacuum tweezers of thepick-and-place machine, moved towards the optoelectronic module andfixed in place in or on the optoelectronic module.

Further advantages, advantageous embodiments and developments will befound in the exemplary embodiments described below in conjunction withFigures, wherein

FIG. 1 is a schematic view of an optoelectronic module according to theinvention in accordance with an exemplary embodiment,

FIGS. 2A and B show a schematic rear view and front view, respectively,of a plug-in connector which is arranged on the optoelectronic moduleaccording to the invention in accordance with the exemplary embodiment,

FIG. 3 shows a schematic plan view of a holding device arranged in theplug-in connector,

FIGS. 4A and B are schematic sectional views of the holding device,

FIG. 5 shows schematically the insertion of an encoding element into theholding device,

FIGS. 6A and B show schematic sectional views of the holding device withthe encoding element inserted,

FIGS. 7A, B and C show a locking device of the holding device in threedifferent movement positions and a process for the production of anoptoelectronic module in accordance with a first exemplary embodiment,

FIGS. 8A, B, C and D show a process for the production of anoptoelectronic module in accordance with a second exemplary embodiment,and

FIGS. 9A, B and C show a process for the production of an optoelectronicmodule in accordance with a third exemplary embodiment.

In the exemplary embodiments and Figures, elements that are identical orsimilar or have identical action may in each case be denoted by the samereference numerals. The elements illustrated and the relative sizes ofthe elements to one another should not be regarded as to scale; rather,the size of individual elements, such as, for example, layers,components, devices and regions, may have been exaggerated in thedrawings for the purpose of better clarity and/or better understanding;this may relate to individual dimensions or to all dimensions of theelements.

FIG. 1 shows schematically an optoelectronic module according to theinvention, indicated as a whole by reference numeral 100. The modulecomprises a plurality of semiconductor devices 10 which in operationemit blue light that is converted into white light by conversionelements (not shown in detail). The semiconductor devices 10 aresoldered to a ceramic circuit board 11 which is adhesively bonded andattached to a metal core circuit board 30 serving as carrier element. Onthe metal core circuit board 30 there is further arranged a temperaturesensor 33 which is adapted to determine the temperature of theoptoelectronic module 100 or, in particular, of the plurality ofsemiconductor devices 10. It is also possible for each semiconductordevice 10 to be assigned one temperature sensor, so that eachtemperature sensor essentially determines the temperature of thesemi-conductor device associated therewith.

The temperature sensor 33 can be in the form of a thermoelement.Furthermore, the temperature sensor 33 can also be atemperature-dependent resistor which can have a negative temperaturecoefficient (NTC resistor) or a positive temperature coefficient (PTCresistor). Alternatively, it is also possible for a semiconductordevice, for example a transistor or a diode, to be used as temperaturesensor.

There is further soldered to the metal core circuit board 30 a plug-inconnector 40 in which electrical conductor tracks 41 a, b, c, d, e, f(visible in FIG. 2A) are embedded. The electrical conductor tracks 41 a,b, c, d, e, f terminate in a plurality of angular soldering pins 31 a,b, c, d, e, f, which are soldered to corresponding soldering surfaces 34a, b, c, d, e, f of the metal core circuit board 30. The solderingsurfaces 34 c, d, e, f are each part of respective electrical conductortracks 32 c, d, e, f, which are arranged on the metal core circuit board30 and via which the semiconductor devices 10 and the temperature sensor33 are each supplied with operating current.

By means of a complementary connector (not shown), the optoelectronicmodule 100 is connected via the plug-in connector 40 and via a wiringharness to a control unit (not shown) which provides an operatingcurrent for the semiconductor devices 10 and the temperature sensor 33and evaluates the measured data supplied by the temperature sensor 33.

In the plug-in connector 40 there is provided a recess 21 inside which aholding device 20 for fixing in place a surface-mountable device isarranged. FIGS. 2A and B show schematic views of the plug-in connector40 from two different perspectives. The electrical conductor tracks 41a, b, c, d, e, f embedded in the plug-in connector 40 are exposed on oneside of the plug-in connectors 40 where they merge into plug-in contactswhich are insertable into suitable sockets of the complementaryconnector (not shown). On the opposite side of the plug-in connector 40the electrical conductor tracks 41 a, b, c, d, e, f are led to theoutside and are connected to the angular soldering pins 31 a, b, c, d,e, f which are soldered to the soldering surfaces 34 a, b, c, d, e, fprovided for that purpose on the metal core circuit boards 30. Theelectrical conductor tracks 41 c, d are used to supply electrical powerto the temperature sensor 33, and the electrical conductor tracks 41 e,f are used to supply electrical power to the semiconductor devices 10.The angular soldering pins 31 a, b connected to the electrical conductortracks 41 a, b terminate on soldering surfaces 34 a, b, which are notconnected to any additional electrical conductor track on the metal corecircuit board 30.

FIG. 3 shows a schematic, perspective view of an upper side of theplug-in connector 40. The holding device 20 provided in the recess 21comprises two tongues 23 a, b made of elastic material, for example ofmetal or plastics, which serve as locking elements and project from twolateral inner walls 26 a, b of the recess 21.

FIGS. 4A and B show two sectional views of the holding device 20, fromwhich it can be seen that the electrical conductor tracks 41 a, b guidedthrough the plug-in connector 40 project into the recess 21 where theyform electrical contact elements 22 a, b (of which only the electricalcontact element 22 b is shown in FIGS. 4A and 4B).

FIG. 5 is a further schematic, perspective view of the plug-in connector40, showing an insertion direction 24 along which an encoding element 50in the form of a surface-mountable device is insertable into the holdingdevice 20. The insertion direction 24 runs perpendicular to the surfaceof the metal core circuit board 30 and parallel to the lateral innerfaces 26 a, b of the recess 21. The encoding element 50 is morespecifically an SMD resistor, the resistance value of which correspondsto a measured brightness of the light emitted by the optoelectronicmodule 100. The encoding element 50 has two electrical contact surfaces51 a, b which are in electrical contact with the electrical contactelements 22 a, b of the holding device 20 once the encoding element 50has been inserted into the holding device 20.

FIGS. 6A and B show two schematic, perspective views of the holdingdevice 20 with the encoding element 50 inserted therein. The elastictongues 23 a, b act as locking lugs which allow displacement of theencoding element 50 along the insertion direction, so that the insertionof the encoding element 50 requires the application of only a smallamount of force. In a fixing position 25, in which the encoding element50 is located in FIGS. 6A and 6B, the tongues 23 a, b are located in alocking position by means of which the encoding element 50 isirreversibly fixed in place, that is to say the encoding element 50cannot be removed from the holding device 20 at all or can be removedtherefrom only by the application of a substantial amount of force.Along the insertion direction 24, the encoding element is fixed by formlock in the fixing position 25 on the one hand by the elastic tongues 23a, b and on the other hand by the electrical contact elements 22 a, b,on which the encoding element 50 is supported by means of its twoelectrical contact surfaces 51 a, b. Perpendicular to the insertiondirection 24, the encoding element 50 is fixed by form lock by innerfaces 26 a, b, c, d of the recess 21. As a result of the form lockfixing of the encoding element 50, the holding device 20 actsadditionally as a protective device which encompasses most of theencoding element 50.

Preferably, the encoding element 50 is an SMD resistor in the form of aparallelepiped. Accordingly, the distances between the lateral innerfaces 26 a, b, c, d of the recess 21 and the length and the arrangementof the elastic tongues 23 a, b are preferably chosen so that they areable to effect form lock fixing of a parallelepiped of such dimensions.

The encoding element 50 carries information relating to the initialbrightness of the optoelectronic module 100, that is to say a brightnesswhich has been determined by a measuring apparatus at a referencecurrent and reference temperature prior to the actual start-up of theoptoelectronic module 100. More specifically, the resistance value ofthe encoding element 50 is chosen so that direct or indirect measurementof the resistance value enables conclusions to be drawn as to theinitial brightness of the optoelectronic module 100. Via the electricalconductor tracks 41 a, b, which are connected to the two electricalcontact surfaces 51 a, b of the encoding element 50 via the electricalcontact elements 22 a, b of the holding device 20, a control unitconnected thereto, which serves for driving the optoelectronic module100, is able to determine the resistance value of the encoding element50. The electrical conductor tracks 41 a, b and the furtherintermediately connected elements, such as, for example, a complementaryconnector inserted into the plug-in connector 40 and a wiring harnessrunning between the complementary connector and the control unit,accordingly serve as transmission means via which the informationprovided by the encoding element 50 can be acquired by the control unit.

On the basis of the initial brightness of the optoelectronic module 100and optionally of a measured temperature value determined by thetemperature sensor 33, the control unit provides via the electricalconductor tracks 41 e, f and 32 e, f a suitable operating current withwhich the semiconductor devices 10 are powered.

Preferably, resistance values from an e-series are used which aresufficiently distinguishable in terms of ageing and the temperaturebehaviour of the resistor and are each associated with specificbrightness values.

FIGS. 7A to C show the locking device formed by the elastic tongues 23a, b in three different movement positions. FIG. 7A shows the elastictongues 23 a, b in a locking position in which they form an acute angleof less than 45°, preferably less than 30°, with the insertion direction24 and project from the two lateral inner walls 26 a, b of the recess21. The encoding element 50 is then displaced along the insertiondirection 24 until the fixing position 25 inside the holding device 20is reached (shown in FIG. 7C).

During the displacement of the encoding element 50 along the insertiondirection 24, the elastic tongues 23 a, b yield and are pressed to theside, and are thereby elastically deformed, by the displacement of theencoding element 50. As a result, the elastic tongues 23 a, b are movedinto a receiving position (shown in FIG. 7B) in which they allow thecontinued displacement of the encoding element 50 along the insertiondirection 24. Once the fixing position 25 has been reached (FIG. 7C),the elastic tongues 23 a, b are returned to their original shape underthe action of a elastic restoring force and are then located in thelocking position again. In this position they fix the encoding element50 in place in such a way that displacement in a direction opposite tothe insertion direction 24 is prevented. On the base face 27 of therecess 21 there are arranged the electrical contact elements 22 a, b onwhich, in the fixing position 25, the encoding element 50 is supportedby its two electrical contact surfaces 51 a, b.

A process for the production of an optoelectronic module in accordancewith a first exemplary embodiment is described hereinbelow. First of allan optoelectronic module 100 shown in FIG. 1 is provided. Then abrightness of the white light emitted by the optoelectronic module 100is measured at a reference current and a reference temperature. Asuitable encoding element 50 representing the brightness of theoptoelectronic module 100 is then selected, is lifted by a vacuumtweezers of a pick-and-place machine and inserted into the holdingdevice 20 shown in FIGS. 7A to C. More specifically, from a plurality ofidentically constructed SMD resistors which represent differentbrightness values, a device is selected the resistance value of whichbest represents the measured brightness of the optoelectronic module 100and, with the aid of the vacuum tweezers of the pick-and-place machine,is pressed into the holding device 20 of the optoelectronic module 100.

FIGS. 8A to D illustrate a process for the production of anoptoelectronic module in accordance with a second exemplary embodiment.In a first process step, an optoelectronic module is provided which hasa recess 21 which, for example, can again be provided in the plug-inconnector 40. In contrast to FIGS. 7A to C, in this exemplary embodimentno locking elements in the form of elastic tongues or the like areprovided in the recess 21. On the base face 27 of the recess 21,however, there are again arranged electrical contact elements 22 a, b.Once the brightness of the optoelectronic module has been measured, asuitable encoding element 50 is inserted into the recess 21 in such away that the two electrical contact surfaces 51 a, b of the encodingelement 50 lie on the electrical contact elements 22 a, b arranged inthe recess 21 (FIG. 8B). A cover element 28 is then arranged over therecess 21, so that the encoding element is fixed by form lock on the onehand by the lateral inner faces 26 a, b of the recess and on the otherhand by the cover element 28 and the base face 27 (shown in FIGS. 8C andD). As a result, a holding device 20 which fully encompasses theencoding element 50 is provided.

FIGS. 9A to C illustrate a process for the production of anoptoelectronic module 100 in accordance with a third exemplaryembodiment. This embodiment differs from the second exemplary embodimentin that no cover element is arranged on the recess 21. Rather, first ofall the encoding element 50 is inserted into the fixing position 25(shown in FIG. 9B). Then, from the outside, a heated stamp 60 is pushedalong the insertion direction 24 onto a surface of the optoelectronicmodule in a region including the recess 21, so that material isplastically deformed in a deformation region 29. As a result, there isagain produced in turn a holding device 20 which fully encompasses theencoding element 50.

What is claimed is:
 1. A process for the production of an optoelectronicmodule having the steps of: a) providing an optoelectronic module havingat least one semiconductor chip provided for emitting electromagneticradiation; b) measuring an optical or electronic parameter of theoptoelectronic module; c) providing an encoding element, especially inthe form of a surface-mountable device, wherein the encoding elementcarries information relating to the optical or electronic parameter ofthe optoelectronic module; and d) fixing the encoding element in placein or on the optoelectronic module.
 2. The process according to claim 1,wherein in step a) an optoelectronic module is provided and in step d)the encoding element is inserted or pushed into the fixing positionalong the insertion direction, wherein the optoelectronic modulecomprises: at least one semiconductor chip provided for emittingelectromagnetic radiation; and at least one holding device which isadapted to fix in place the encoding element, wherein the holding devicecomprises at least one locking device which is movable between a lockingposition and a receiving position, wherein in the receiving position theencoding element can be displaced along an insertion direction towards afixing position inside the holding device, and wherein in the lockingposition the locking device is adapted to effect at least partial fixingof the encoding element in the fixing position.
 3. The process accordingto claim 1, wherein at least one of the steps a) to d) is carried out atleast partly in a pick-and-place machine.
 4. The process according toclaim 1, wherein the encoding element is a surface-mountable device andthe encoding element is fixed in place in or on the optoelectronicmodule using surface-mounting technology.
 5. The process according toclaim 1, wherein one holding device is provided which is adapted to fixin place the encoding element, wherein the optoelectronic modulecomprises a carrier element and the holding device is arranged on or inthe carrier element or on or in a plug-in element or plug-in connectorattached to the carrier element.
 6. The process according to claim 5,wherein the holding device is formed at least in part by a recess in thecarrier element, in the plug-in element or in the plug-in connector andwherein the encoding element is arranged in the recess.
 7. The processaccording to claim 1, wherein the optoelectronic module comprises aholding device having a recess which is adapted to fix in place theencoding element, and wherein after fixing the encoding element a heatedstamp is pushed onto a surface of the optoelectronic module in a regionincluding the recess, so that material is plastically deformed in adeformation region and the holding device fully encompasses the encodingelement.
 8. The process according to claim 1, wherein a holding deviceis provided which is adapted to fix in place the encoding element, andwherein the holding device is adapted to effect an irreversible fixingof the encoding element.
 9. The process according to claim 1, whereinthe optoelectronic module comprises a holding device having a recesswhich is adapted to fix in place the encoding element, and wherein acover element of the holding device is arranged over the recess, so thatthe encoding element is fixed by a form locking manner on the one handby lateral inner faces of the recess and on the other hand by the coverelement and by a base face of the recess, and in this way the holdingdevice fully encompasses the encoding element.
 10. The process accordingto claim 1, wherein a holding device is provided which is adapted to fixin place the encoding element, said the holding device comprising atleast one locking device which is movable between a locking position anda receiving position, wherein in the receiving position the encodingelement can be displaced along an insertion direction towards a fixingposition inside the holding device and wherein in the locking positionthe locking device is adapted to effect at least partial fixing of theencoding element in the fixing position.
 11. The process according toclaim 10, wherein the locking device comprises at least one lockingelement made of an elastic material which is adapted to allow adisplacement of the encoding element along the insertion directiontowards the fixing position as a result of its being elasticallydeformed in consequence of the displacement, and further, once thefixing position of the encoding element has been reached, to assume itsoriginal shape and hereby fix the encoding element in place.
 12. Theprocess according to claim 11, wherein the locking element is in theform of a tongue which, in the locking position, forms an acute angle ofless than 30° with the insertion direction and projects from a lateralinner wall of the holding device.
 13. The process according to claim 10,wherein in step d) the encoding element is inserted or pushed into thefixing position along the insertion direction.
 14. The process accordingto claim 1, wherein the encoding element carries information relating toan initial brightness of the optoelectronic module and a resistancevalue of the encoding element is chosen so that direct or indirectmeasurement of the resistance value enables conclusions to be drawn asto the initial brightness of the optoelectronic module.
 15. A processfor the production of an optoelectronic module having the steps of: a)providing an optoelectronic module having at least one semiconductorchip provided for emitting electromagnetic radiation; b) measuring anoptical or electronic parameter of the optoelectronic module; c)providing an encoding element in the form of a surface-mountable devicehaving two electrical contact surfaces wherein the encoding elementcarries information relating to the optical or electronic parameter ofthe optoelectronic module; and d) fixing the encoding element in placein or on the optoelectronic module, wherein the optoelectronic modulehas a holding device which comprises a recess and electrical contactelements being arranged on a base face of the recess, wherein in afixing position, the two electrical contact surfaces of the encodingelement lie on the electrical contact elements in the recess.
 16. Aprocess for acquiring information provided by the encoding element ofthe optoelectronic module produced according to claim 15, wherein acontrol unit for driving the optoelectronic module is provided, andwherein information provided by the encoding element is acquired by thecontrol unit via electrical conductor tracks, said electrical conductortracks being connected to the two electrical contact surfaces of theencoding element via the electrical contact elements of the holdingdevice.
 17. The process according to claim 16, wherein the encodingelement carries information relating to an initial brightness of theoptoelectronic module and a resistance value of the encoding element ischosen so that direct or indirect measurement of the resistance valueenables conclusions to be drawn as to the initial brightness of theoptoelectronic module.